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홈 | MPW / CDC | IP Library

"한국 반도체산업의 경쟁력"

IDEC에서 설계인력양성의 발판을 마련하겠습니다.

IP명 A High-Efficiency Low-Cost Hybrid Dual-Path Three-Level Step-Down Converter for SSD Memory Systems
Category Analog Application SSD Memory Systems
실설계면적 5㎛ X 9㎛ 공급 전압 5V
IP유형 Hard IP 동작속도 1MHz
검증단계 Silicon 참여공정 HM-2003
IP개요 This paper proposed a hybrid dual-path three-level
buck converter for a single-input multi-output system with a single
inductor. The proposed DC-DC converter can provide low-ripple
output voltage and inductor current by reducing switching node
voltage (VX) and fast response which guarantee stable operation
and life time of Solid stated drive (SSD). This converter consists
one small size inductor (DC resistance > 300mΩ) and two flying
capacitors. As the result, the converter can achieve low output
ripple and high efficiency. The proposed buck converter will be
fabricated in TSMC 180nm standard CMOS process with 1.8V/5V
supply voltage, and the core and total chip size will be about 4mm
x 4mm and 5mm x 5mm, respectively.
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