| IP명 | Single-ended Simultaneous Bidirectional Transceiver with Crosstalk Cancellation Schemes for Shield-Less Ultra-Short-Reach Channel in Next Generation Die-to-Die Link | ||
|---|---|---|---|
| Category | Analog | Application | AI 가속기 및 Die 간 통신을 위한 회로 |
| 실설계면적 | 4㎛ X 4㎛ | 공급 전압 | 1.0V |
| IP유형 | Hard IP | 동작속도 | 10GHz |
| 검증단계 | Silicon | 참여공정 | SF028-2502 |
| IP개요 | As the cost and complexity of manufacturing large monolithic ICs in advanced technology nodes increases, chipletbased heterogeneous integration is emerging as a cost-effective alternative. By partitioning systems into smaller die fabricated on optimal technology nodes and assembling them in a system-inpackage (SiP), this approach improves yield, enables scaling beyond reticle limits, and reduces overall costs. Compute-intensive applications such as AI, HPC, and networking drive the need for dieto-die (D2D) interconnects offering high bandwidth, energy efficiency, and low error rates. Increasing bandwidth demands, package pin limitations, and insertion loss challenges in advanced packaging call for innovations in signaling. In this situation, Singleended simultaneous-bidirectional (SBD) NRZ signaling offers a promising solution, doubling pin efficiency and enabling lower perdirection data rates for the same aggregate throughput, thereby reducing insertion loss. But SBD signaling for D2D links will have its own unique signal integrity challenges. We aim to address unique SI challenges of SBD signaling for shield-less 1.5um pitch channel with energy consumption of 0.5pJ/bit and 30Gb/s/pin. |
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